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TABLE 63.5 Material Availability Punching and drilling Copper Epoxy FR-4 Kapton/Apical Upilex Espanex NeoFlex Yes Yes Yes Yes Yes Yes Yes Excimer laser Slow Yes Slow Yes Yes Yes Yes UV:YAG laser Slow Yes Slow Yes Yes Yes Yes Carbon dioxide laser No Yes Yes Yes Yes Yes Yes Plasma etching No Yes No Yes Yes Yes Yes Chemical etching Yes Difficult No Yes Difficult Difficult Difficult

'These are the methods we will need 'for controlling the LCD 'for general methods 'This the main method in this program 'create Cog_TWO 'create freq generator (continued)

Figure 63.11 shows examples of the cost comparison of the technologies for micro-through holes on 50-mm polyimide substrates. Figure 63.11(a) shows cost comparison of micro-size NC drilling versus the excimer laser and UV:YAG laser. NC drilling cost is inversely proportional to hole size. A conventional NC drilling process has small advantages over laser processes for holes smaller than 200 mm in diameter. Figure 63.11(b) shows a cost comparison of different laser systems. The UV:YAG laser is cost-advantageous in the 25- to 75-mm hole diameter range. However, its cost increases exponentially with hole size, especially for holes larger than 75-mm in diameter. The cost of the excimer laser process is more stable. It is proportional to

The final DVT component example is the geographic map. This component allows spatial data, such as latitude and longitude, or an address, to be plotted on a map. At each point on the map, the component can show different information such as data values or even graphs. At the heart of this feature is the requirement for a map server, such as Oracle MapViewer, to serve up the maps on which the data will be plotted. In this example, we will use http://elocation.oracle.com/mapviewer to serve up the maps.

FIGURE 63.11 Relative cost comparison by hole creation technology, (a): Comparison of NC drilling cost in Excimer and YAG lasers, (b): Comparison of alternative laser processes (c): Comparison of NC laser, plasma, and chemical etch.

hole sizes in the 20- to 200-mm diameter range Carbon dioxide lasers show extremely lower drilling cost than the excimer laser and UV:YAG laser for the holes larger than 75 mm in diameter It is very possible to generate more than 10,000 holes, 100 mm in diameter, in 1 min with the Galvano mirror This is a Diamond Carbon Dioxide Laser SystemTM that has higher productivity than a traditional carbon dioxide TEA laser system Figure 6311(c) shows a drilling cost analysis of a plasma etching system and a chemical etching system as compared to a laser system or an NC drilling systemA unique cost feature of the etching procedure is that it does not depend on the number of holes or shapes, but on area sizes Therefore, there are big cost advantages for circuits that have a large number of holes in a small area 633.

6 Wet Processes for the Flexible Materials The conveyer systems of the wet processes designed for rigid circuit boards do not work properly for thin flexible materials They can t make a high process yield generating a lot of wrinkles or scratches, even though the flexible sheet is fixed on a leader board or carrier frame Appropriated conveyer system should be introduced for the volume production lines of the thin flexible circuits Several new ideas have been introduced to convey the thin flexible materials in the wet manufacturing processes Large diameter conveyer rings with smooth surface have been employed to reduce the scratches on the soft thin copper foil surface Smaller ring pitches, for both line direction and transverse direction, results in an overlapped conveyer system, which avoids the drop down between the rings and winding of the thin materials on conveyer rolls.

Strings and thin bars between the conveyer rings are not recommended to use These devices make small scratches on the soft thin copper surface, as shown in Fig 6312..

Program 18-3

FIGURE 63.12 Special wheel conveyor system for thin, flexible materials showing high density and smooth wheels. (Source: Camellia.)

It looks like a conflict to have a stable conveyor and an effective spray of the liquids, therefore synchronized spray array with mild pressure are required to optimize the condition. A high spray pressure makes fluttering and partial distortion for the thin materials especially after etching. Standard wet processing machines are designed to process both single side and double side circuits. Well-controlled soft rubber rolls are recommended for the conveyers of the RTR wet manufacturing process to avoid damage to the circuit surface.