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birt ean 13

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TABLE 63.7 Coverlay Process Options Accuracy (minimum opening) Traditional film coverlay Film coverlay + laser drilling Screen print liquid ink Photoimageable, dry film type Photoimageable, liquid type Low (800 mm) High (50 mm) Low (600 mm) High (80 mm) Reliability (flexing endurance) High (long) High (long) Acceptable (short) Acceptable (short) Acceptable (short) Material selection PI, PET PI, PET Epoxy, PI Epoxy, PI, acrylic Epoxy, PI Equipment/ tooling NC drill, heat press Heat press, laser Technical hurdles Need long experience Low

High (80 mm)

Program 19-1 Displaying All the Segments on One Display, One after the Other, Rapidly So That They Look Like They Are All on Simultaneously (continued)

Unfortunately, it requires very complicated, labor-intensive processes, and it is difficult to introduce automatic manufacturing systems.Another big issue is that the standard film coverlay process cannot make small openings with high dimensional accuracy because of the manual handling of thin film materials. Fine openings smaller than 200 mm in diameter with high dimensional accuracy and better than 100 mm positioning have been required for flexible circuits that need high-density interconnect (HDI). Examples include SMT of CSP or chip type passive components. Screen printing of flexible ink can provide a low-cost solution for volume production. However, it cannot provide a better solution for small openings with high dimensional accuracy. The technology of photo-imageable coverlay could be the right solution to the problem of having fine openings with high dimensional accuracy along with keeping the cost down by automation. A suitable photo-sensitive material has been in demand to satisfy all of the requirements. 63.5.1 Film Coverlay A typical coverlay manufacturing process is shown in Fig. 63.26. Generally the same film materials are chosen for the base film and the coverlay film. A B-stage adhesive such as epoxy

or acrylic resin is coated on one side of the film covered with a release sheet The epoxy-based coverlay films have a short shelf life in the room temperature and must be kept in a refrigerator Openings for access windows are made by NC drilling or punching with a release sheet The surface of traces must be cleaned before coverlay lamination takes place It is difficult to introduce an automation system for the lamination process because the materials are very unstable after window openings are made Manual alignment is the solution for this process unless the circuit needs an accurate registration higher than +/ 05 mm After the coverlay film is temporarily fixed on the circuit, the adhesive layer is cured in a heat press or autoclave similar as multi-layer rigid boards A suitable curing condition should be chosen carefully based on the circuit design and material conditions.

The ADF Faces DVT components are a valuable aid in building rich applications. Using graphs, gauges, hierarchy viewers, and other components, complex data structures and relationships can be easily visualized. This chapter has introduced some of these components and explained how: Bar graphs can be used to plot data points against a series. Reference lines can be added to a bar graph. Pie graphs allow you to visualize data as a proportion. Gauges can be used to represent a data value within a range or against threshold limits. Hierarchical information can be shown using the ADF Faces hierarchy viewer. ADF Faces provides a component for plotting spatial information on a map.

Epoxy resins change flow properties significantly by thermal aging, even though they are kept at a low temperature; therefore, a detailed conditioning should be performed based on the flow properties of the adhesives A high flow of the adhesive resin makes good encapsulation of the conductors, but it also causes a squeeze out of the resin in the openings and makes serious stains on the copper traces On the other hand, a low resin flow causes a poor encapsulation and results low bond strength and air voids beside the traces The selection of the press pad materials and separation films is another key factor to have good encapsulation and minimum squeeze out of the glue from the edges A vacuum press or a vacuum autoclave helps to make good encapsulation of the conductors, eliminating voids or air traps beside the traces, especially for a thick copper foil.