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66.2.2 Manufacturing Processes for Flying Leads The fragility of flying leads, caused by the lack of dielectric support, is probably the largest disadvantage in the manufacturing process. Proper circuit design and layout is the key to the manufacturing process yield and subsequent cost and physical performance of the circuit. The most conventional manufacturing process for generating a flying-lead construction involves a pre-punching process similar to the device hole process of tape automated bonding (TAB). Figure 66.3 shows this process schematically. There is no proprietary technology or special tooling required for manufacturing the pre-punched window in the base substrate. This process, however, offers the manufacturer very little flexibility and is fairly labor intensive, which makes it difficult to maintain high productivity rates. The handling of unstable punched films, along with thin, fragile copper foils, makes it difficult to achieve the high manufacturing yields required to support the cost model associated with high-density flexible circuits. These unstable film substrates also make it difficult to maintain dimensional accuracy between the fingers and the window, a key element for HDI flexible circuits. Adhesive flow or squeeze-out from the edge of the punched film along the conductor can also be an issue when dealing with small window exposures. Openings of less than 1.0 mm are difficult to create with high dimensional accuracy and yield. Alternative technologies have been developed to generate high-density flying-lead designs with higher accuracy. Laser ablation, plasma etching, and chemical etching are just a few of the possibilities and are illustrated schematically in Fig. 66.4. A comparison of small opening capabilities of each of the processes is illustrated in Fig. 66.5, while a comparison of the technical capabilities of the processes is shown in Table 66.1. With these manufacturing technologies, many kinds of flying-lead constructions became possible. .net pdf 417 PDF - 417 C# Control - PDF - 417 barcode generator with free C# ...
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2 May 2019 ... NET framework. It is the second article published by this author on encoding and decoding of PDF417 barcodes. The first article is PDF417 ... different facets. These facets are the areas in which the consumer of the template can add their own content. To define an area in the template as a facet, drag and drop a Facet Ref component FIGURE 66.4 Manufacturing process for flying lead flexible circuit construction using (a) laser ablartion and (b) plasma etching or chemical etching. TABLE 66.1 Comparison of Flying-Lead Manufacturing Technologies Prepunching (NC routing) Minimum slit width (mm) Material availability Design flexibility Capability for high-density flying leads Technical hurdles Registration Damage on flying leads Process cost Investment for large volume 800 Fair Limited Limited Low Difficult Serious High Small Laser abrasion 50 Wide Wide Wide Fair Fair Small High High Plasma etching 100 Wide Limited Fair High Fair Fair Low High Chemical etching 70 Limited Limited Fair High Fair Fair Low Medium .net pdf 417 ASP. NET PDF-417 Barcode Generator - Generate 2D PDF417 in ...
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NET PDF-417 Generator SDK Tutorial tells users how to generate 2D PDF-417 Barcodes in .NET Framework with C# class. Laser Abrasion The excimer laser process has the capability to generate small openings with clearly defined edges on high-density flexible circuits.The narrow slit openings can be made smaller than 50 mm wide. The excimer process is available for all types of flexible circuit materials with high accuracy and fine openings. A carbon residue, typically removed by a suitable wet cleaning process, is found around the edges of the openings. One of the biggest disadvantages of excimer laser system is its slow speed, which accounts for the high processing cost when dealing with larger openings. The UV:YAG laser process offers a higher productivity rate than the excimer laser for very small openings. It has the ability to cut both copper foil and organic substrate materials with .net pdf 417 Best 20 NuGet pdf417 Packages - NuGet Must Haves Package
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PDF417 is a stacked linear barcode format used in a variety of applications such as transport, identification cards, and inventory management. "PDF" stands for ... good quality, which makes it suitable for cutting small openings on a wide range of high-density flexible circuits. Unfortunately, the productivity rate becomes extremely slow when cutting larger openings. Actually, it becomes impractical from a cost standpoint to utilize a UV:YAG laser system for openings larger than 10,000 mm2. Carbon dioxide TEA lasers, as well as diamond carbon dioxide lasers, have a much higher productivity rate when producing openings wider than 70 mm. The definition of the opening and quality of the edges, however, is somewhat less desirable than for other laser systems. In order to facilitate surface plating, a suitable cleaning process such as plasma is required to remove the thin residue remaining on the copper surface. A copper mask process helps to improve both quality and speed of the carbon dioxide laser process. The excimer laser process, like the UV:YAG laser system, minimizes the potential for thermal damage on very thin flying leads. The carbon dioxide laser generates a remarkable amount of heat. The beam power density of the laser must be controlled carefully in order to process 18-mm copper with high-density flying leads narrower than 100 mm wide. Now that we know how to initialize the LCD and how to clear it, we are ready to position the cursor at the desired line and the desired horizontal position so that the first character can be displayed where we want. We have to pass a line number and the horizontal position to this method. We define these two variables at the top of the method, as is standard practice in Spin. These are local variables. The code for positioning the cursor is shown in Program 21-3. Plasma Etching and Chemical Etching Plasma and chemical etching processes are other suitable choices for generating high-density flying-lead structures Although their capabilities are somewhat less than those of laser processing, these processes can provide a lower-cost model of high-volume processing A copper foil mask is required in order to define the exposure area, and specific process conditions are required to remove organic substrates effectively These processes are quite effective for singlesided substrates Double-sided substrates can be processed in this manner given very specific materials and construction A big advantage of these processes is the unlimited number of holes or openings that can be processed simultaneously Performance value is high, while manufacturing costs remain fixed when larger sizes or higher numbers of holes are processed The plasma process is capable of etching all kinds of organic materials; however, it must be performed in a vacuum chamber. .net pdf 417 2D barcode PDF417 library download | SourceForge. net
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