rdlc data matrix

rdlc data matrix

rdlc data matrix

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Declarative component development would typically happen in a separate project from the main application development effort, so create a new ADF ViewController project. The next step is to create the declarative component in that project. Select File | New and, in the New Gallery dialog, select JSF and then JSF Declarative Component. This displays the Create JSF Declarative Component dialog in which you define information for the name of the component, the library name in which the component will be packaged, and also facets and attributes. As shown in Figure 17-3, enter customerPanel for Declarative Component Name and click Add Tag Library to define a name for the library. Create a tag library with Tag Library Name set to ComponentLibrary. Having done that, you now need to specify the facets and attributes. Just like a page template, a declarative component can have a number of facets, the areas within the component where the consumer of the component can add their own content. If you want to define a facet where the consumer of the component can add their own content, you can do so here. Attributes, as with page templates, are used as parameters to pass information into the declarative component. Since this declarative component is going to be displaying data, you need a way of passing that data into the component. In this case, define three attributes, one for each of the fields in the declarative component. As shown in Figure 17-3, add the three attributes

Switches EIA-448-23: Surface Mountable Switches, Qualification Test EIA-520aaad: Detail Specification for Single Pole, Single Throw, Surface Mount Pushbutton Switches

repeat 4 SEND_CHAR ("b") POSITION (1,2) repeat 4 SEND_CHAR ("C") repeat 4 SEND_CHAR ("d") waitcnt(10_000_000+cnt) PRI INITIALIZE_LCD waitcnt(500_000+cnt)

EIA-520daad: Detail Specification for Single Pole, Double Throw, Surface Mount Subminiature Size Toggle Switches EIA-5200000-C: Generic Specification for Special-Use Electromechanical Switches of Certified Quality EIA-SP-2186: Detail Specification for Single Pole, Double Throw, Surface Mount Subminiature Size Toggle Switches EIA-SP-3162: Detail Specification for Single Pole, Single Throw, Surface Mount Pushbutton Switches IECQ-PQC-41: Detail Specification, Dual-in-Line Switch, Surface Mountable, Slide Actuated US0003

Printed Boards IPC-6011: General Performance Requirements for Printed Boards IPC-6012: Performance Specification for Rigid Printed Boards IPC-6013: Performance Specification for Flexible Printed Boards IPC-6015: Performance Specification for Organic Multichip Module Structures (MCM-L) IPC-6016: Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards IPC-6018: Microwave End Product Board Inspection and Test IPC/JPCA-6202: Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards MIL-PRF-31032: Printed Circuit Board/Printed Wiring Board Manufacturing, General Specification MIL-P-50884: Military Specification for Printed Wiring, Flexible, and Rigid Flex MIL-PRF-55110:Performance Specification,Printed Wiring Boards,Rigid General Specification Materials IPC-3406: Guidelines for Electrically Conductive Surface Mount Adhesive IPC-3407: General Requirements for Isotropically Conductive Adhesives IPC-3408: General Requirements for Anisotropically Conductive Adhesive Films IPC-4101: Specification for Base Materials for Rigid and Multilayer Boards IPC-4103: Specification for Plastic Substrates, Clad or Unclad, for High Speed/High Frequency Interconnection IPC-4110: Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards IPC-4121: Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications IPC-4130: Specification and Characterization Methods for Nonwoven E Glass Mat IPC-4202: Flexible Base Dielectrics for Use in Flexible Printed Wiring IPC-4203: Adhesive Coated Dielectric Films for Use as Cover Sheets IPC-4204: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry IPC-4411: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

IPC-4412: Specification for Finished Fabric Woven form E Glass for Printed Boards IPC-4552: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards IPC-4553: Specification for Immersion Silver Plating for Printed Circuit Boards IPC-4562: Metal Foil for Printed Wiring Applications IPC-CC-830A: Qualification and Performance of Electrical Insulation Compounds for Printed Board Assemblies IPC-CF-148: Resin Coated Metal for Multilayer Printed Boards IPC-CF-152A: Metallic Foil Specification for Copper/Invar/Copper (CIC) for Printed Wiring and Other Related Applications IPC/JPCA-4104: Specification for High Density Interconnect (HDI) and Microvia Materials IPC-SM-840C: Qualification and Performance of Permanent Solder Mask for Printed Boards J-STD-004: Requirements for Soldering Fluxes J-STD-005: General Requirements and Test Methods for Electronic Grade Solder Paste J-STD-006: General Requirements and Test Methods for Soft Solder Alloys and Fluxed and Non Fluxed Solid Solders for Electronic Soldering Applications

IPC-C-406: Design and Application Guidelines for Surface Mount Connectors IPC-D-279: Reliability Design Guidelines for Surface Mount Technology Printed Board Assemblies IPC-1902: Grid Systems for Printed Circuits (equivalent to IEC 60097) IPC-2141: Design Guide for High-Speed Controlled Impedance Circuit Boards IPC-2221: Generic Standard on Printed Board Design IPC-2222: Sectional Design Standard for Rigid Organic Printed Boards IPC-2223: Sectional Design Standard for Flexible Printed Boards IPC-2224: Sectional Standard for Design of PWBs for PC Cards IPC-2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies IPC-2226: Design Standard for High-Density Array or Peripheral Leaded Component Mounting Structures IPC-2251: Design Guidelines for Electronic Packaging Utilizing High Speed Techniques IPC-2252: Design and Manufacturing Guide for RF/Microwave Circuit Boards IPC-2615: Printed Board Dimensions and Tolerances IPC-7351: Generic Requirements for Surface Mount Design and Land Pattern Standard IPC-7525: Guidelines for Stencil Design IPC-7530: Guidelines for Temperature Profiling for Mass Soldering (Wave and Reflow) Processes IPC/JPCA-2315: Design Guide for High Density Interconnects (HDI) and Microvia J-STD-026: Semiconductor Design Standard for Flip Chip Applications J-STD-027: Mechanical Outline Standard for Flip Chip or Chip Scale Configurations MIL-STD-2118: Design Standard for Flexible Printed Wiring