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This chapter presents the elements of data exchange, the data exchange process, its pitfalls and best practices, the most widely used data exchange formats and their main characteristics, and evolution drivers in data exchange The electronics manufacturing marketplace is a dynamic domain where supply chains of trading partners compete in a global economy in which time to market and efficiency are key factors for success Outsourcing is becoming more common; printed circuit board (PCB) fabrication has been outsourced in the 1980s and early 1990s, whereas assembly is following very quickly Data communication is a vital key to supply chain management Efficient and accurate data exchange is an extremely important factor in customer supply networks The challenge of more efficient and accurate data exchange has only recently begun to be addressed and the future for data exchange improvements holds much potential 181.

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17:

1 Data Exchange Format Defined Once the design of a printed wiring board (PWB) is complete, it is necessary to pass the design intent to internal or external suppliers for manufacture and assemblyThis is mostly done using electronic data file transfer A short dictionary entry for a data exchange format would read: Virtual format that one computer program outputs and another one reads and creates an internal representation thereof that can be manipulated and outputThe main criteria for data exchange format quality are its clarity and the accuracy with which it passes the design intent between trading partners 1812 PCB Design Process Overview PCB design and manufacturing process (see Fig 181) proceeds as follows: 1.

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PUB POSITION (LINE_NUMBER, HOR_POSITION) | CHAR_LOCATION 'Pos crsr 'HOR_POSITION : Horizontal Position : 1 to 16 'LINE_NUMBER : Line Number : 1 or 2 CHAR_LOCATION := (HOR_POSITION-1) * 64 'figure location CHAR_LOCATION += (LINE_NUMBER-1) + 128 'figure location SEND_INSTRUCTION (CHAR_LOCATION) 'send the instr to position cursor PUB SEND_CHAR (DISPLAY_DATA) 'set up for writing to the display CHECK_BUSY 'wait for busy bit to clear before sending OUTA[ReadWrite] := Low 'Set up to read busy bit OUTA[RegSelect] := High 'Set up to read busy bit OUTA[Enable] := High 'Set up to toggle bit H>L OUTA[DataBit7..DataBit0] := DISPLAY_DATA 'Ready to SEND data in OUTA[Enable] := Low 'Toggle the bit H>L (continued)

In the schematic stage, components and their interconnection pattern (netlist) are defined, simulated, and verified for functionality using schematic capture tools such as Mentor s Design Architect and Cadence s Concept (The schematic interconnection list is usually called schematic netlist It is an electrical network-based grouping of connection points of.

PCB Editing Layout Routing The focus of the data exchange process is what is output from here to the preproduction design department at fabrication and assembly

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the form component ID + pin ID. A physical or PCB-level netlist is the same grouping, whereas the points are described by their physical [geometric] location on the board and the board side[s] from which they can be tested.) 2. The editing stage begins with the layout phase. The component shapes (still virtual and within design tools) and the interconnection list are transferred to the target PCB design tool (such as Mentor s Boardstation or Cadence s Allegro) and are manually or (semi-) automatically placed on the PCB as determined by the system s mechanical engineering and manufacturing rules.

3. Still within the PCB editing stage, the layout phase is followed by the routing phase. This routing (manual and automatic) implements the interconnection list in a PCB conductive pattern composed of traces, planes, and vias (vertical conductors). 4. After PCB routing and layout have been completed, the output phase begins, where the design is output from the PCB editing system and sent to bare board manufacturing to produce the actual bare board layers and then laminate, drill, and finish them. 5. When PC boards are ready, the design data together with the boards are sent to assembly houses, where the components from the bill of materials (BOM) are assembled onto the finished bare board at the locations specified by the design.

Board Manufacturing Data In addition to PCB design data, copious information pertinent to board manufacture is exchanged between partners in the manufacturing and assembly process Such information can include standard compliance requirements (eg ,UL), statements of workmanship (SOW), and delivery and packaging instructions Modern data exchange formats address some of these comprehensive data exchange issues The design-to-manufacturing data exchange process should ideally progress to become online collaboration The drivers of this progression are globalization, the supply chain, and time-to-market pressure Historically, the PCB design-to-manufacturing flow began with manually laid-out artworks whose images were printed on copper-clad laminates and developed, etched, and stripped within the same vertically integrated organization Advances in miniaturization and multilayer board technology led to the need for specialization, and outsourcing of bare board fabrication became the norm.

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