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In most instances, the RF shield is a continuous plate or box that encloses the circuits Unfortunately, this continuous box creates a dead zone in the air flow directly above the components within the box, degrading natural convection for those components To enhance the thermal performance of components within RF shields, perforations or meshing of the RF shield cage is recommended If these perforations are kept less than 1/10 the wavelength of the shielded electromagnetic radiation, the RF shield will function adequately to quiet the circuit and block out extraneous signals while allowing air flow through the shield to cool the interior components If additional steps are taken, the shield can be used to spread heat from hot components inside the shield over a larger section of the PCB, thereby maximizing convection and radiation cooling for the heated components Figure 17.

11 shows a schematic of a shield over a stacked package component It is normally difficult to conduct heat from the top device in such a stack to the PCB, but when the RF shield is brought into contact with the top device, heat can conduct into the shield and down to the PCB It is suggested that the thermal connection between the shield and the electrical components be made with a thermal epoxy or thermal grease after the shield is soldered in place to avoid issues with mechanical tolerances.

16:

Two issues have arisen regarding RoHS requirements for the flexible circuit materials: flameretardant molecules with bromine in adhesive resins, and heat resistance for high-temperature processing with lead-free soldering.Although the issue of bromine is not actually a part of the RoHS requirement, it has been linked to the general environmental issues of printed circuit materials and processes. Adhesiveless copper laminates can be the solution for the both of these problems because they do not use adhesive layers and have much higher heat resistance than adhesive-based

laminates. However, because some of the applications need adhesive-based copper laminates, manufacturers of flexible laminates have been developing alternative materials without bromine-based flame-retardant reagents. There have been technical barriers to developing new materials with a good balance of performances for coverlay eliminating bromine compounds. Film coverlay have to have an adhesive layer with some flame-retardant reagent. Few new epoxy resins have good balance for all of the physical performances without bromine compounds. New materials of photoimageable coverlay have been developed without bromine molecules. Not many choices offer a balanced performance, especially high flexibilities for dynamic flexing. Polyimide-based photoimageable coverlays are the solution to satisfy the all of the physical requirements, but these polyimide materials are remarkably more expensive.

Because of the broad wiring capabilities now available, it is possible to cover all 3-D wiring of an electronic product by one flex circuit, or by a set of multilayer rigid/flex circuits, without the need for connectors, extra cables, and soldering. However, to achieve this, the shape of the flex circuit may be very complicated and the size may be large. As a result, the final cost could be extremely high. If so, the use of flexible circuits is not an acceptable solution, especially for large-volume consumer applications. It may be better to divide the wiring into two or more parts to make each circuit simpler.A combination of simple circuits can be less expensive than one flex circuit, even though it mandates several connections between different circuits.A circuit designer should also consider the manufacturing convenience of flex circuits. There are serious differences among rigid circuit boards. A small design modification can sometimes reduce the total cost significantly.

gain:=8+||positionError+integ/4 'add it all up for the gain. gain:=gain <# MaxGain 'gain must be less than MaxGain {{EXERCISES: Play with the equation on the last few lines to see what happens to the motor response to the error signal. Adjust the TargetPosition:=TargetPosition+PotOne line to see what happens. Work on making the response faster. There is a delay right now. How do you handle the overshoot when the gain has to increase real fast Disconnect power to motor and turn shaft and watch the LCD and the oscilloscope to see how the gain changes as the error changes. Connect the oscilloscope to the PWM line. This is very instructive and very important to understand well. }}

To achieve the best cost-performance combination for a wiring design with flex circuits, an appropriate design procedure is recommended, as illustrated in Fig. 62.1. The steps in the process are as follows: 1. A design concept for an electronic product is determined according to the basic specifications for the final product. 2. A logical circuit design and electronic circuit design are formulated. 3. A design for the equipment housing is made according to the final product concept. (This should sometimes be done independently in the case of consumer applications, especially for portable electronic products.) 4. The circuit design is formulated. Appropriate circuit selection is conducted depending on total conditions such as allowed space, sizes of components, operating temperature, possible assembling process, required reliability, and so on.